Qualcomm’s Latest Chip Aims to Reduce Audio Lag in Connected Devices
Qualcomm has launched an updated version of its S3 Gen 2 Sound platform, targeting gamers. The latest chip is specifically designed for adapters and dongles, and boasts sub-20ms latency, as well as an extra backchannel for voice chat.
The extension to Qualcomm S3 Gen 2 Sound combines Snapdragon Sound and LE Audio for “ultra-low sub-20ms latency for lag-free wireless audio and a voice channel for in-game chat.” The chipmaker notes that it reduces latency even further by skipping voice chat and delivering just audio. Additionally, a Qualcomm representative tells ReturnByte that it could also work with wireless charging cases that have audio transmission capabilities (handy for in-flight wireless listening).
It also supports the latest version of Auracast, a broadcast standard based on Bluetooth LE Audio. Dongles and adapters using Qualcomm’s platform can stream from devices such as TVs, phones, computers and consoles to a virtually unlimited number of nearby listeners. The technology can be used for assistive listening at public events, sending notifications or simply sharing music with nearby friends.
“With each generation of Snapdragon Sound, we’ve reduced latency and improved sound quality, and with this latest addition to our Qualcomm S3 Gen 2 Sound lineup, we’re delivering our best wireless gaming experience yet,” said Mike Canevaro, vice president of marketing at Qualcomm. “We know from our annual State of Sound survey that consumers want lag-free audio for gaming, but until now this immersive wireless audio experience has been reserved for a proprietary gaming solution.”
Qualcomm has yet to announce the specific devices we’ll see the expanded platform on, but the reveal could mean compatible accessories aren’t far behind.
